Multibeam echo sounder. The MEBL fits easily into almost any fab.
Multibeam echo sounder. We provide chipmakers with what they need – hardware, software and services – to produce patterns on silicon through direct-write lithography. Jul 29, 2025 · Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions Find out more about Multibeam Corporation and links to information on careers, news, and how to get in touch. Synopsys CATS was custom modified for Multibeam, and is fully integrated into Multibeam system software. The MEBL fits easily into almost any fab. Jul 15, 2025 · Multibeam writing modules are designed to fit together based on fabrication needs. Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) direct write solution. Apr 25, 2024 · Multibeam’s Multicolumn Electron Beam Lithography (MEBL) Systems are integrated with Synopsys CATS data preparation software, creating an easier and faster path from chip design to production. By joining us now, you’ll have the opportunity to launch a game-changing product that could impact everything from the next generation IoT (internet of things) to augmented reality to space exploration. Leveraging a patented miniature e-beam column design, Multibeam developed the industry’s first high-productivity multicolumn e-beam lithography (MEBL) system to achieve rapid prototyping, advanced packaging, unparalleled chip security and IoT chiplet integration among other applications. This allows up to three modules to be in production at once, which can help boost throughput even further to accommodate production needs. Multibeam systems empower IC leaders to make patterns that are impossible, difficult, or too expensive for mask-based solutions, with breakthrough time to market advantages. Multibeam systems are also designed to be modular and can accommodate two additional process modules to achieve desired throughput. Features: Both physics-based and model-based corrections included (3D proximity effect, thermal, etc. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. ) Designed for use in IC production; customer usability Handles GDSII, OASIS, MULTIGON formats. Chip producers can have the freedom of choice to meet their production needs. At Multibeam Corporation, we innovate technology that will shape the future of microelectronics. xhtpw fzvzvyuc mlelw ygv qyco fahnlv motmxe xzapk xkd sjqhbzb